Chemical Mechanical Planarization (CMP) is a polishing process used to manufacture wafers for the semiconductor industry. It requires the use of a polishing tool and polishing slurry. The slurry in the tool should contain small particles/agglomerates (＜1 μm), overwise to increase the level of defectives on the semiconductor wafer surface.
One of the solutions for decreasing the level of defects caused by large slurry particles is through the use of slurry filtration. Through suitable filtration system, a range of particle sizes could be removed, with the advantage of pleated filters including high dirt-holding capacity, flow rate and other performances.

Separation Goals

● Remove particulates and agglomerates while leaving abrasive components

Application Requirements
● Filters must have low extractables, not to introduce foreigners.
● Filters must be flushed by pure water, to keep TOC under acceptable level.
● Terminal filters must keep reliable retention of particulates for a long time.
● Filters must provide consistent high flow rates and be robust to satisfy mass manufacturing processes.

Recommendation